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Richard Blickman is a highly respected figure in the global semiconductor industry, best known as the co-founder and long-serving President and Chief Executive Officer (CEO) of BE Semiconductor Industries N.V. (Besi). He co-founded the company in 1995 and, through his strategic vision and relentless focus on innovation, transformed it into a leading global supplier of semiconductor assembly equipment. With a background in Mechanical Engineering and prior experience at ASM International and Philips, Blickman's leadership was instrumental in navigating Besi through numerous industry cycles. He successfully positioned the company at the forefront of advanced packaging technologies, such as hybrid bonding, which are critical for the next generation of high-performance computing and AI chips. He retired from his CEO role in 2024, leaving behind a legacy of technological leadership and significant shareholder value creation.
Richard Blickman's work history includes a series of influential roles in various companies. Here is a detailed list of his professional journey:
Co-founded BE Semiconductor Industries (Besi) in 1995 and served as its CEO for nearly 30 years, transforming it from a startup into a leading global supplier of semiconductor assembly and packaging equipment with a multi-billion euro market capitalization.
Under his leadership, Besi became a key innovator in advanced packaging, particularly in developing and commercializing hybrid bonding technology, which is essential for manufacturing next-generation AI and high-performance computing (HPC) processors.
Spearheaded a strategy of profitable growth and operational excellence, resulting in Besi consistently delivering strong financial results and creating substantial long-term value for its shareholders, making it one of the top-performing stocks in the European technology sector during his tenure.
Delft University of Technology - Year 1975
Eidgenössische Technische Hochschule Zürich - Year 1973
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BE Semiconductor Industries N.V. (Besi) is a leading global supplier of semiconductor assembly equipment for the electronics and computer industries. The company develops and manufactures advanced packaging systems, such as die attach, packaging, and plating solutions, that are critical for creating smaller, faster, and more powerful electronic devices. Besi's primary customers are multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.
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