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VIA Technologies, Inc. is a pioneering Taiwanese fabless supplier of integrated circuits, motherboard chipsets, x86 processors, and embedded systems. Founded in 1987, VIA has evolved to focus on low-power computing platforms, AI, IoT, and smart city solutions. The company provides a wide range of products including System-on-Modules (SOMs), single-board computers (SBCs), and complete embedded systems tailored for industrial automation, transportation, healthcare, and smart city applications. VIA is known for its commitment to innovation in energy-efficient computing and its growing portfolio of AI-driven solutions for edge computing.
Serves as the global nerve center for VIA Technologies, housing key departments such as research and development, corporate strategy, global sales and marketing leadership, operations management, and administrative functions.
A modern office facility equipped with advanced R&D laboratories and engineering workspaces designed to foster collaboration and technological innovation. It reflects the company's focus on cutting-edge technology.
VIA Technologies cultivates an engineering-driven work environment that emphasizes innovation, technical excellence, and collaborative problem-solving. The culture supports continuous learning and adaptation, characteristic of a company at the forefront of Taiwan's competitive tech industry.
The headquarters' strategic location in New Taipei City places VIA within Taiwan's prominent technology and electronics manufacturing ecosystem, providing access to a highly skilled talent pool, key suppliers, and industry partners.
VIA Technologies supports a global customer base through a network of offices and partners across Asia, North America, and Europe. Key functions supported globally include sales and marketing, research and development, technical support, and logistics for its chipset, processor, and embedded system product lines. This international footprint allows VIA to cater to diverse regional market needs and collaborate with global technology leaders.
8F, 535 Zhongzheng Road
Xindian District, New Taipei City
N/A
Taiwan (R.O.C.)
Address: 940 Mission Ct, Fremont, CA 94539, USA
To strengthen VIA's market penetration in North America, provide localized customer support, and foster partnerships within the US tech ecosystem for embedded and IoT products.
Address: Building A, No. 16, Lane 666, Zhangheng Road, Pudong New Area, Shanghai, China
To cater to the expansive and rapidly evolving Chinese technology market, drive innovation in AI and IoT solutions tailored for regional demands, and build strong local industry collaborations.
Address: Various offices supporting sales and R&D, specific public address may vary.
To leverage Shenzhen's unique position in the global electronics supply chain, facilitate closer ties with manufacturing partners, and tap into the region's dynamic tech innovation landscape.
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As of April 2025, VIA Technologies' leadership includes:
VIA Technologies has been backed by several prominent investors over the years, including:
No major C-suite level executive hires or departures have been publicly announced by VIA Technologies in the past 12 months. The company maintains a stable leadership team focused on its strategic initiatives in AI and embedded systems.
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VIA Technologies likely utilizes common corporate email formats. While specific internal structures can vary, a frequent pattern for tech companies involves combinations of first name, last name, and initials.
A common format is [firstinitial][lastname]@viatech.com
Format
jdoe@viatech.com
Example
75%
Success rate
VIA Technologies Newsroom • March 5, 2024
VIA Technologies announced the VIA AMOS-3007, a rugged, fanless embedded system designed for demanding Edge AI applications. It leverages the MediaTek Genio 1200 octa-core processor for high performance and low power consumption....more
VIA Technologies Newsroom • January 3, 2024
VIA Technologies announced its collaboration with Amazon Web Services (AWS) to demonstrate the new VIA Mobile360 M820, an in-vehicle video telematics system, at CES 2024. The system integrates AWS IoT Core and Kinesis Video Streams for enhanced fleet management capabilities....more
VIA Technologies Newsroom • October 24, 2023
VIA introduced the VIA Edge AI Developer Kit, featuring the Qualcomm QCS8550 processor, aimed at accelerating the development of high-performance, low-power edge AI devices for applications such as robotics, drones, and industrial automation....more
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