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Fraunhofer IZM (Institute for Reliability and Microintegration) in Berlin is a globally recognized leader in applied research and development for electronic packaging and system integration. It focuses on developing and manufacturing robust and reliable electronic systems for various industries, including automotive, industrial electronics, medical technology, and ICT. Key research areas include wafer-level packaging, 3D integration, high-frequency electronics, photonics integration, and environmental and reliability engineering. Fraunhofer IZM bridges the gap between academic research and industrial application, offering R&D services, prototyping, and technology transfer to its partners.
The Berlin headquarters serves as the central hub for research, development, administration, and strategic direction for Fraunhofer IZM. It houses advanced laboratories, cleanroom facilities, and testing equipment for microelectronics packaging and system integration.
State-of-the-art cleanroom facilities (class ISO 1 to 7), advanced assembly and packaging labs, extensive reliability testing capabilities, and specialized labs for areas like RF technology and photonics.
Characterized by a highly collaborative, innovative, and research-driven environment. Employees, including scientists, engineers, and technicians, work on cutting-edge projects with strong ties to both academic institutions and industrial partners. Emphasis is placed on interdisciplinary teamwork and practical application of research findings.
The Berlin location is significant due to its proximity to numerous tech companies, research institutions, and universities, fostering a vibrant ecosystem for innovation in microelectronics. It's a key player in Germany's and Europe's high-tech research landscape.
While its physical laboratories and primary operations are in Germany, Fraunhofer IZM Berlin supports functions globally through international research collaborations, participation in EU-funded projects, partnerships with multinational corporations, and by providing R&D services to clients worldwide. Its research findings and developed technologies have a global impact on the microelectronics industry.
Gustav-Meyer-Allee 25
Berlin
Berlin
Germany
Address: Ringstraße 12 (IZM-ASSID All Silicon System Integration Dresden Branch Lab), 01468 Moritzburg (near Dresden)
To leverage the strong semiconductor industry and research environment in Dresden, contributing to advanced packaging solutions for next-generation microchips.
Address: Argelsrieder Feld 6 (IZM-ASSID, Application Center for Substrates, Interconnects and Device Integration), 82234 Weßling-Oberpfaffenhofen
To collaborate closely with the German Aerospace Center (DLR) and other aerospace and automotive companies located in the Munich metropolitan area.
Address: Siemens-Halske-Ring 2, 03046 Cottbus
To support regional economic transformation by establishing high-tech research and development, particularly in emerging fields relevant to future industries.
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As of April 2025, Fraunhofer IZM' leadership includes:
Fraunhofer IZM has been backed by several prominent investors over the years, including:
As a research institute, top-level executive changes (Institute Director level) are infrequent. No major publicly announced hires or exits at the Director/Deputy Director level for Fraunhofer IZM Berlin have been prominently noted in the last 12-18 months. Leadership transitions are typically well-planned and announced with significant lead time.
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Fraunhofer Institutes typically use a standardized email format. For Fraunhofer IZM, the common format is firstname.lastname@izm.fraunhofer.de.
firstname.lastname@izm.fraunhofer.de
Format
max.mustermann@izm.fraunhofer.de
Example
95%
Success rate
Fraunhofer IZM Website • October 17, 2023
Researchers at Fraunhofer IZM have developed a quantum algorithm that significantly speeds up failure analysis in microelectronic components, potentially revolutionizing quality control in the semiconductor industry....more
Fraunhofer IZM Website • May 8, 2024
Fraunhofer IZM is exploring the use of mycelium, the root network of fungi, as a biodegradable substrate for electronic components, aiming to create more sustainable electronics and reduce e-waste....more
Fraunhofer IZM Website • March 20, 2024
Fraunhofer IZM is intensifying its research efforts in neuromorphic hardware, aiming to develop energy-efficient AI systems inspired by the human brain. This initiative aligns with growing demands for advanced AI processing capabilities....more
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