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EV Group (EVG) is a globally recognized technology and market leader in wafer-processing solutions for semiconductor, microelectromechanical systems (MEMS), and nanotechnology applications. Founded in 1980, EVG specializes in wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning, and inspection equipment. Their solutions are integral to advanced packaging, compound semiconductors, power devices, and various emerging technologies. EVG is renowned for its innovation, high-quality manufacturing, and strong customer partnerships, enabling the development and production of next-generation electronic devices and components.
The headquarters houses EVG's primary R&D facilities, advanced manufacturing operations, global sales and marketing, customer support, and corporate administration.
State-of-the-art cleanroom facilities, advanced manufacturing lines for precision equipment, extensive R&D laboratories, and modern office spaces designed to foster collaboration and innovation.
EVG's headquarters fosters a culture of precision engineering, innovation, and quality. It emphasizes teamwork, continuous improvement, and a strong customer focus, typical of a high-technology Austrian company with a global reach.
This site is critical for maintaining EVG's technological leadership, developing new products, and coordinating its global strategy and support network. It's the birthplace of EVG's core technologies and manufacturing excellence.
EV Group supports its worldwide customer base through a robust global network of subsidiaries and strategic partners. This network provides comprehensive sales, customer support, technical service, process development assistance, and application laboratories in key semiconductor manufacturing regions across North America, Europe (including its Austrian HQ), and Asia (Japan, Korea, Taiwan, China, Singapore, and Southeast Asia). This ensures close proximity to customers for rapid response and tailored solutions.
DI Erich Thallner Strasse 1
St. Florian am Inn
Upper Austria
Austria
Address: 7700 S River Parkway, Tempe, AZ 85284, USA
To serve and expand EVG's presence in the significant North American semiconductor and nanotechnology ecosystem.
Address: Queen's Tower C, 15F, 2-3-5 Minato Mirai, Nishi-ku, Yokohama, Kanagawa 220-6215, Japan
To provide dedicated support and solutions to Japanese customers in the semiconductor and related high-tech industries.
Address: 1F, No. 8, Tai Yuen 2nd Street, Tai Yuen Hi-Tech Industrial Park, Jhubei City, Hsinchu County 302, Taiwan, R.O.C.
To support the world's largest concentration of semiconductor manufacturing and advanced packaging operations in Taiwan.
Address: #501, Business Center, Gyeonggi Bio-Center, 147 Gwanggyo-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, 16229, Korea
To cater to the advanced technology needs of the dynamic South Korean electronics and semiconductor market.
Address: Room 601-602, 6/F, Building 1, No. 3000 Longdong Avenue, Pudong New Area, Shanghai 201203, P.R. China
To support the development and expansion of China's domestic semiconductor industry.
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As of April 2025, EV Group' leadership includes:
EV Group has been backed by several prominent investors over the years, including:
EV Group maintains a stable leadership team. No major C-level executive hires or departures have been publicly announced or widely reported in the past 12 months. Minor shuffles or promotions at director levels below the top executive team might occur but are generally not publicised extensively.
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EV Group primarily utilizes the email format combining the first initial and last name, or first name and last name separated by a dot. For example, 'j.doe@evgroup.com' or 'jdoe@evgroup.com'.
f.last@evgroup.com, flast@evgroup.com
Format
j.doe@evgroup.com
Example
90%
Success rate
EV Group Press Release • February 6, 2024
EVG announced a collaboration with Teramount to implement wafer-level optics for datacom and telecom applications, leveraging EVG's NanoBond® technology for photonic integrated circuit (PIC) assembly and packaging....more
EV Group Press Release • December 5, 2023
EVG announced enhancements to its Heterogeneous Integration Competence Centers™ by adding new lithography systems and metrology solutions to support advanced packaging development and customer demonstrations....more
Semiconductor Today • October 24, 2023
EV Group (EVG) is showcasing LITHOSCALE – its first maskless lithography system, specifically designed to overcome limitations of existing maskless lithography solutions by combining high resolution with high throughput and no wafer-size restrictions – in booth B1420 at SEMICON Europa 2023 in Munich, Germany (14–17 November)....more
EV Group Press Release • July 11, 2023
EVG announced it has once again been honored with a 3D InCites Award. The company was named the 2023 Device Manufacturer of the Year for its NanoCleave™ layer release technology, which enables ultra-thin layer transfer for advanced packaging and 3D integration....more
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