BE Semiconductor Industries N.V. (commonly known as Besi) is a leading global supplier of semiconductor assembly equipment. Headquartered in Duiven, Netherlands, Besi develops and manufactures advanced packaging solutions for the electronics and semiconductor industries. Its systems are used to produce a wide range of semiconductor devices for applications such as electronics, mobile internet, cloud servers, computing, automotive, IoT, and solar energy. Besi Netherlands B.V. is the primary operating entity in the Netherlands for the Besi group.
The Duiven headquarters serves as the global command center for BE Semiconductor Industries N.V., housing executive management, finance, R&D leadership, strategic marketing, sales, and corporate support functions. It drives the company's worldwide strategy and operations.
Modern office complex with advanced facilities, likely including R&D labs and demonstration areas for Besi's sophisticated semiconductor assembly equipment. Designed to foster innovation and collaboration.
Characterized by a high-tech, innovative, and results-driven environment. Emphasizes precision engineering, quality, and customer focus. The culture is international, reflecting Besi's global operations and diverse workforce.
The Duiven headquarters is pivotal for Besi's global operations, R&D, and strategic decision-making, positioning it as a key player in the semiconductor equipment industry. Its location in the Netherlands offers access to a skilled talent pool and strong infrastructure.
Besi maintains a strong global presence with production facilities, R&D centers, and sales & service offices strategically located across Asia, Europe, and North America. This network supports key functions including the manufacturing of advanced semiconductor assembly equipment (e.g., die attach, packaging, and plating systems), research and development of next-generation technologies like hybrid bonding, direct sales operations, localized customer application support, field service engineering, and efficient spare parts management to serve its global clientele.
Ratio 6
Duiven
Gelderland
Netherlands
Address: Plot 23, Jalan Delima 1/3, Subang Hi-Tech Industrial Park, Batu Tiga, 40000 Shah Alam, Selangor, Malaysia
Serves as a critical center for Besi's production, supply chain management, and customer support in the Asia-Pacific region, a key market for semiconductor manufacturing.
Address: Innkreis 20, 6241 Radfeld, Austria
Drives innovation in Besi's die bonding product lines and serves as a key R&D and manufacturing site for these specialized systems, supporting global customers and the European market.
Address: 2 Corporation Road, #04-09/10, Corporation Place, Singapore 618494
Supports Besi's customer base in the strategically important South East Asian semiconductor industry, ensuring close proximity for sales, service, and collaboration.
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As of April 2025, Besi' leadership includes:
Besi has been backed by several prominent investors over the years, including:
The core Management Board of BE Semiconductor Industries N.V. (CEO, CFO, CTO, SVP Global Operations) has demonstrated stability. No direct hires or exits for these top executive roles were publicly announced in the last 12 months based on available press releases and recent annual reports. Leadership within the executive management team has remained consistent. Changes primarily occurred at the Supervisory Board level, with routine reappointments and departures as per governance schedules during the 2023 AGM.
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Besi (BE Semiconductor Industries N.V.) likely uses a standard corporate email format, commonly firstname.lastname@besi.com. Variations might exist, but this is a frequent pattern for international companies.
firstname.lastname@besi.com
Format
jane.doe@besi.com
Example
90%
Success rate
Besi Investor Relations / GlobeNewswire • April 25, 2024
BE Semiconductor Industries N.V. announced its Q1 2024 financial results, reporting revenue of €164.0 million, a net income of €54.0 million, and a significant increase in orders to €211.3 million, driven by strong demand in AI applications and hybrid bonding....more
Besi Investor Relations / GlobeNewswire • February 22, 2024
Besi announced its financial results for the fourth quarter and full year 2023. Q4-23 revenue reached €159.6 million with net income of €50.7 million. For the full year 2023, revenue was €578.5 million with net income of €159.0 million. The company highlighted continued strong interest in its hybrid bonding solutions....more
Besi Investor Relations / GlobeNewswire • January 8, 2024
Besi announced it received a significant follow-on order for 20 hybrid bonding systems. These systems are designated for high-volume manufacturing of advanced logic devices by a leading Integrated Device Manufacturer (IDM), indicating strong market adoption for Besi's hybrid bonding technology....more
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