ASMPT Nexx, integrated within ASMPT's Semiconductor Solutions segment, is a leading provider of advanced deposition technologies, including Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) systems. These solutions are critical for cutting-edge semiconductor wafer manufacturing and advanced packaging applications, such as wafer-level packaging (WLP), fan-out, copper pillar, and through-silicon via (TSV). ASMPT Nexx empowers manufacturers to achieve higher yields, improved device performance, and cost-effective production for next-generation electronics.
Serves as a center for research and development, engineering, manufacturing, and support for ASMPT's advanced deposition systems (ECD/PVD), leveraging the expertise from the former Nexx Inc.
State-of-the-art R&D labs and manufacturing facilities focused on semiconductor capital equipment. Proximity to a rich ecosystem of technology companies and research institutions in the Greater Boston area.
A culture of innovation, technical excellence, and collaboration, driven by the demands of the fast-paced semiconductor industry. Employees are typically engaged in developing and supporting high-tech manufacturing solutions.
This location is significant for maintaining and advancing ASMPT's leadership in metallization technologies critical for advanced semiconductor packaging, building upon Nexx's pioneering work in ECD/PVD.
As part of ASMPT, Nexx's advanced deposition technologies are supported by ASMPT's extensive global network. This includes R&D centers, manufacturing plants, sales offices, and customer support teams strategically located across Asia, Europe, and North America. Key functions supported globally include technology development, application engineering, system manufacturing, sales and marketing, and 24/7 customer service, ensuring comprehensive support for semiconductor manufacturers worldwide.
900 Middlesex Turnpike, Building 5
Billerica
MA
USA
Address: 2 Yishun Avenue 7, Singapore 768924
Serves as the central hub for ASMPT's extensive operations across Asia and globally, overseeing key markets in semiconductor manufacturing.
Address: 11/F, Gateway TS, 8 Cheung Fai Road, Tsing Yi, New Territories, Hong Kong
Facilitates corporate governance, financial reporting, and strategic communication for the publicly traded entity within the Greater China financial hub.
Address: Rupert-Mayer-Straße 44, 81379 München, Germany
Central point for ASMPT's European operations, catering to advanced manufacturing needs, particularly in automotive, industrial, and IoT sectors.
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As of April 2025, ASMPT NEXX, Inc.' leadership includes:
ASMPT NEXX, Inc. has been backed by several prominent investors over the years, including:
ASMPT announced a key transition in its finance leadership with the appointment of a new Group Chief Financial Officer in early 2024.
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ASMPT commonly uses standard corporate email formats. The most prevalent patterns are [firstname].[lastname]@asmpt.com and [firstinitial][lastname]@asmpt.com. Variations might exist based on region or department.
firstname.lastname@asmpt.com
Format
john.doe@asmpt.com
Example
90%
Success rate
Semiconductor Digest / ASMPT Investor Relations • April 24, 2024
ASMPT released its Q1 2024 financial results, noting sequential revenue growth and strong performance in its Semiconductor Solutions segment, particularly in advanced packaging tools like Thermo-Compression Bonding (TCB). The company anticipates continued demand in this high-growth area....more
EET Asia / ASMPT Press • May 28, 2024
ASMPT highlighted its cutting-edge solutions at SEMICON Southeast Asia 2024, demonstrating technologies for heterogeneous integration, advanced packaging (including those related to Nexx's expertise areas), and integrated smart factory solutions to enhance manufacturing productivity and efficiency....more
ASMPT Investor Relations • March 26, 2024
ASMPT published its 2023 Annual Report, detailing the company's financial performance, strategic initiatives in key growth areas like advanced packaging and automotive, and its commitment to ESG (Environmental, Social, and Governance) principles....more
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